eMPack® M – The Future of High-Performance Power Modules
As electric mobility continues to advance, the need for high-performance power modules becomes increasingly important. The eMPack M offers SiC and IGBT options, providing exceptional power density and efficiency in an ultra-compact design. Designed for e-mobility applications like electric vehicles, it meets the evolving demands of next-gen drive systems. The eMPack M covers a improved range of performance and different power outputs, with a more compact size and higher power density compared to the standard eMPack, contributing to the future of e-mobility.
eMPack® M Benefis at a Glance
Designed for the demanding needs of electric drive trains, the eMPack M is a high-performance power module built to maximize power density in a compact package. With its innovative design and cutting-edge technology, the eMPack M offers an ideal solution for a wide power range of e-mobility applications.
- Maximized power density with next-generation SiC technology
- Compact design to fit into a wide range of applications
- Improved packaging efficiency, reducing overall system costs
- Highly versatile cooling and chip configuration options
- Optimized for high-performance electric drive trains
eMPack® M Product Specifications
Specification | Value/Range |
|---|---|
Package Size: | 135.3mm x 95.8mm |
Power Density: | ~3.4kW per cm² |
Chip Type Options: | SiC & IGBT |
Voltage Range: | 1200V SiC (250Arms – 500Arms), 750V SiC (300Arms – 500Arms), 750V Si (500Arms) |
Cooling Options: | Cu/Al, Open/Closed |
Current Range (SiC): | 250Arms – 500Arms |
Current Range (Si): | 500Arms |
Exciter Options: | With or Without |
Technology: | Direct Pressed Die |
Auxiliary Terminals: | Press-fit |
Main Terminals: | Laser-weldable |