Wind Energy
Power Electronics for Wind Turbines
Customer service
Product service
Performance Range
This portfolio includes a wide range of products for wind energy applications, from small to medium power modules for pitch and yaw drives to high power components for multi-megawatt power converters. From individual modules including dedicated drivers to high power SKiiP 4 IPMs and ready-to-use power electronic stacks – Semikron Danfoss has the solution.
The demand for reliable spare parts to ensure continuous energy harvesting until the end of the turbine life is becoming increasingly important. Semikron Danfoss has a broad portfolio of products to ensure reliable operation and maintenance for wind turbine converters.
Our products offer maximum reliability for on- and offshore wind turbines both in industry standard packages and in high power SKiiP 4 IPMs and power electronic stacks.
- YAW & PITCH DRIVES5kW - 100kW
- Compact designs and high power density
- High peak overload capabilities
- Multiple axis in one drive or modular drives with common DC bus
- Highest reliability and lifetime
- MAIN CONVERTER1MW - 18MW
- Compact designs and high power density
- High reliability in harsh environments up to 2200VDC and 1380VAC
- SPARE PARTS & SERVICE1MW - 18MW
- SEMIKRON advanced power modules for maximum reliability and efficiency
- Customized stacks for dedicated wind turbine converters
- Customized heatsinks for IPMs (SKiiP)for integration into converters
Operation & Maintenance
Wind Turbine O&M
Today, over 400,000 wind turbines are in operation in the field world-wide. The demand for reliable spare parts to ensure continuous energy harvesting until the end of the turbine life is becoming increasingly important. Semikron Danfoss has a broad portfolio of products to ensure reliable operation and maintenance for wind turbine converters. From individual power modules, IPMs and drivers to dedicated, customized retrofit stacks – Semikron Danfoss has the right solution!
Benefits
Semikron Danfoss offers a broad portfolio with industry standard power modules such as the SEMITRANS and SEMiX family. It includes SKiiP IPMs with customized coolers to fit into your wind turbine converter. The range is rounded off with highly reliable stacks based on solder-free SKiM 93 modules featuring sintered chips. This technology allows for optimized thermal conductivity from chip to heatsink and runs the chip at about 20°C lower than the OEM stack. Semikron Danfoss also offers newly designed driver boards based on the latest Semikron Danfoss ASIC technology with digital signal transmission and additional protection functions.
Key Features
- Broad portfolio of industry standard modules
- Semikron Danfoss advanced power modules for maximum reliability and efficiency
- Customized stacks for dedicated wind turbine converters
- Customized heatsinks for IPMs (SKiiP) for integration into converters
- Drivers and adapter boards with highly reliable Semikron Danfoss ASIC technology
Product Highlights
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Pushing Performance in SEMITRANS 10 3-Level Topologies -
Pushing Performance in SEMITRANS 20 3-Level Topologies -
Tailor-made SEMiX 3 Press-Fit for Wind Application
Whenever power quality and efficiency are driving factors in power electronics applications, 3-level topologies are the key. This is especially true for renewable energy applications where the combination with the latest Generation 7 IGBTs sets new benchmarks.
SEMITRANS 10 MLI and SEMITRANS 10 P3L enable wind turbine converters to reach voltage ranges up to 1000VAC (1500VDC) in 3-level NPC topology and increase converter efficiency. On top of that, less number of modules are allowed in system under given power when you compare with 3-level topology constructed by standard half-bridge modules. Constraining the long commutation loop to one or two modules makes stray inductance lower than ever in high power application.
Key Features
- Reduced system cost thanks to 3-level topology
- Up to 1.5MW without paralleling
- Lower switching losses thanks to 1200V IGBT
- Generation 7 IGBTs change to available with Generation 7 IGBTs
- Lower THD means lower filter requirements
- Reduced cable diameters or cable losses
- Reduced cooling requirements
- High power density
- Low stray inductance
For ANPC topologies, our new SEMITRANS 20 power module combines lowest stray inductance, highest power density and latest Generation 7 IGBTs to set a new benchmark. Its design, based on standard half-bridge topology,, allows an easy ANPC setup and a low inductance DC-link connection. Combined with sintering technology, power cycling capability is further strengthened, up to 5 times longer lifetime compared to previous generation of soldering technology. This guarantees safe and reliable operation during the overall life cycle. Our experienced engineers will help you with device selection, simulation, and mechanical design under a variety of application scenarios.
Key Features
- New standard package for multiple source strategy
- As low as 10nH stray inductance
- Easy DC-link connection
- Easy interconnection of input and output stages
- High power density
- Symmetrical structure ensures perfect current sharing in
- multi-module paralleling
- Flexible and scalable solution to cover various power ranges
SEMiX 3 Press-Fit helps you reach the same target with less effort. With a deep understanding of user requirements and rich application experience, we are able to allocate valuable silicon to the right circuit position. The lead types of optimized-diode halfbridge and brake chopper modules are perfect examples of our never-ending innovation.
An optimized chipset allows you to achieve cost-effective solutions. The 1700v/450A diode enhanced version with less material can achieve the same performance as a 600A standard halfbridge on the machine side. The 1700V/450A diode-enhanced version brake chopper application instead of a standard halfbridge gives you a competitive solution. Next generation tailormade SEMiX 3 Press-Fit modules with increased density and higher efficiency features are under development.
It‘s Your Choice:
A flexible, cost-effective solution with the same performance or a standard module.
Key Features
- Cost-effective solution strengthens your competitiveness
- Less material without sacrificing performance and reliability
- Standard package
- More balanced design pushes extreme utilization rate of Si material
- Open to customized requirements
Intelligent Power Modules – IPMs
For Maximum Reliability
The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air or water cooling, also with customized heatsinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.
SKiiP 3 has propagated widely through the industrial drive segment. With its sixpack or half-bridge topologies, it covers a current range from 500A up to 2400A.
The SKiiP 4, available in half-bridge topology, has been optimized for highest power cycling requirements and covers the higher power range up to 3600A.
To ensure highest reliability and service life, the power circuitry is 100% solder-free. Sinter technology as die attach replaces the solder layer, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameter and reading application parameter.
High Performance Cooling (HPC) technology has been introduced providing approximately 25% more output capability compared to standard water cooling. A double side mounting HPC water cooler is also available and enables an even higher power density.
Key Features
- 1200V and 1700V
- Half-bridge and sixpack
- 500A to 3600A
- Flexible cooling options: air, water or customized cooling options, high performance cooling, single and double side mounting water coolers
- Paralleled operation for even higher output power possible
Power Electronic Stack Platforms
for Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
Standard Stacks
Our Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver IGBT- and SiC-based stacks for AC voltages from 380V to 1000V. Our standard stacks cover an output current range from 70A to 1400A. Our new SEMIKUBE MLI brings all benefits of 3-level topologies in an off-the-shelf product. It includes all safety and sensing measures for your fast time-to-market.
- Water Cooled Stacks
SEMIKUBE MLI
SEMISTACK RE
Customised Stacks
In addition to standard stacks, Semikron Danfoss has vast experience in developing customer-specific solutions. Engineers are available in our stack centers around the globe to offer specific solutions by adapting existing platforms or designing customized converters.
Four Key Factors for your success
- Shortest time to market
- Cost savings in R&D, production and qualification
- Global Semikron Danfoss stack production footprint
- Highly experienced engineering team
Thermal Interface Materials
Stay Cool - Heat Dissipation is Our Job
Semikron Danfoss was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material (TIM). We now have over two decades of experience and more than 25 million pre-printed modules in the field.
We design print patterns for each module type for the best TIM distribution and thickness when the module is mounted to a heatsink. These patterns are printed on the modules in a clean environment on an automated silkscreen and stencil printing line. Statistical process control (SPC) is used to guarantee consistency. Special packaging is implemented to ensure that the TIM arrives at your production line in pristine condition.
In order to achieve the best thermal performance in all applications, Semikron Danfoss power modules can be supplied with our High Performance Thermal Paste (HPTP).
Alternatively, for ease-of-handling during assembly, most power modules are also available with pre-applied phase change material (PCM). Phase change materials have a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface. With HP-PCM, the new Semikron Danfoss-exclusive High Performance Phase Change Material, we combine the benefits of a phase change material with the performance of the best available paste.
Key Features
- Best possible thermal performance
- Simplified logistics and reduced production costs
- Improved assembly robustness
- Increased lifetime and reliability
Portfolio
- HPTP: High Performance Thermal Paste
- HP-PCM: High Performance Phase Change Material
