
SKiM® 93
SKiM 93 modules can significantly enhance the reliability of inverters, even under substantial active and passive temperature swings as well as demanding power cycle conditions. In addition to sintered chips, pressure contacts and spring technologies with AlCu-bonded diodes and high-performance thermal paste, the SKiM 93 module delivers up to 25% better performance for transient currents with the same chip set and the same lifetime as standard sinter modules. We also provide driver and adapter board solutions for rapid and customer-focused assessment.
Features
- Twice the power cycling capability of standard sinter modules
- 100% solder-free design for extended service life
- Pre-applied High Performance Thermal Paste
- No baseplate for excellent thermal flow
- Sixpack configuration with 3 separate half-bridges
- Low-inductance design thanks to symmetric layout
Applications
- Automotive
- Construction machinery
- Wind energy
- EV charging
Housings
- SKiM 93