Packaging Evolution
New power semiconductor technologies don’t always require a completely new power module. Improvements can be implemented in time-tested packages. This allows designers to improve the performance of their products without major redesign. It also enables the retrofit and repair of fielded products with the latest technology. Procurement benefits from the continued use of a standardized form factor as it allows for multiple sourcing.
Designed for the Future
The SEMIPACK is the ideal example of evolution in action. This industry standard package has improved over six generations and grown into six housing sizes. Advances in internal design, materials, and chips allow for higher current in the same footprint.
The 6th generation of the SEMIPACK 1 utilizes a new internal material stack-up with an improved baseplate — while maintaining the existing external mechanical and electrical connections. These improvements allow a mean on-state current of up to 145A, making it the most powerful 20mm module available on the market.
The newest SEMIPACK 2 incorporates the latest generation of Semikron Danfoss diode and thyristor chips. This allows the SEMIPACK 2 Performance to achieve junction temperatures of up to 150°C. Improvements to chips provide enhanced humidity robustness without modifying the housing. All of this means an unrivaled power density and reliability in the class of 34mm modules.
SEMIPACK®: Best in Class Rectifiers
SEMIPACK® 1: 6th Generation
- ITAV/IFAV up to 145A and ITSM/IFSM up to 2210A
- New, lighter baseplate for optimal heat spread
- Up to 50% lower Rth compared to the market standard
SEMIPACK® 2 Performance
- Higher power density with newest generation of Semikron Danfoss chips
- Controlled rectifiers up to 250A, uncontrolled rectifiers up to 300A
- Improved Rth
- Enhanced humidity robustness
50 years of SEMIPACK®
In 2025, we celebrate the 50th anniversary of SEMIPACK, the world’s first isolated power module. Since revolutionizing power electronics in 1975, SEMIPACK has continuously evolved. Today, the 6th generation is available, with 6 different housing sizes.
SEMIPACK remains a key player in power electronics. A new series with advanced chip technology will soon be launched in the SEMIPACK 2 housing. The SEMIPACK 2 Performance Line offers higher power density and improved reliability. It’s perfect for applications like motor drives, soft starters, and UPS systems.