SEMiX 6 Press-Fit – The complete Press-Fit standard

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The Industry Standard for Reliable Connection Technology

The SEMiX 6p features state-of-the-art press-fit pin technology for both power and auxiliary terminals. With solder-free mounting technology, the 17-mm-high SEMiX 6 maximizes production efficiency. With the SEMiX 6p, connect all terminals in a single production step.

SEMiX^® 6 Press-Fit Benefits

The SEMiX 6p platform offers a scalable, flexible solution for high-performance inverter architectures. The press-fit design ensures full compatibility to the market standard yet optimized for gentle and reliable PCB assembly.

Reduce inverter assembly cost and reach 100% process control using press-fit technology for all the terminals, including auxiliary and power connection. Chip junction temperatures up to 175°C allow far superior performance than comparable solutions on the market. This improved performance combined with our design for minimum power losses is ideal for achieving compact inverter systems on a single PCB basis.

SEMiX^® 6 Press-Fit Key Features

Fully compatible with industry standard
Solder-free assembly
17 mm in height
Press-fit technology for auxiliary and power terminals
Baseplate solution
Flexible platform for custom designs

SEMiX^® 6 Press-Fit Applications

This tested package features a robust baseplate solution combined with a full press-fit concept for all electric terminals, creating a competitive platform for PCB-based inverter solutions. The package is suitable for a broad range of applications, including:

Motor drives
UPS systems
Renewable energy systems

SEMiX^®6 Press-Fit Product Range

SEMiX 6 features 7th generation IGBTs for lower costs thanks to higher current density. The rectifier module portfolio introduces our new SKR PEP up to 2200V and 160kW. This is the perfect match for the IGBT sixpacks in the same package, equipped with the latest IGBT chip technology in 650V, 1200V and 1700V. The converter-inverter-brake modules round off the portfolio in 650V, 1200V and 1700V.

The Industry Standard for Reliable Connection Technology

Press-Fit technology for reliable, solder-free mounting

Fast mechanical connection in cold welding process
Direct elastic connection with defined parameters and high electrical conductivity
Thermal material expansion is absorbed elastically by each individual connection
All the contacts to the PCB connected in just 0.1s
Reliable and controlled press-fit connection

For compact designs and optimized process costs

Efficient, easy to automate production process
Low inductance connection with DC link capacitors
Simpler logistics and fewer parts
Simple ISO coordination
Compact system design

SEMiX^® 6 Press-Fit Product Portfolio

SEMiX 6p: 122.0mm x 62.0mm x 17.0mm (L x W x H)

Rectifier
Type Designation	Topology	V_RRM in [V]	I_D in [A]
SEMiX636D16p	B6U	1600	700
SEMiX586D16p	B6U	1600	700
SEMiX526D22p	B6U	2200	650
SEMiX126DGL22p	B6U + Chopper	2200	400
SEMiX186DGL16p	B6U + Chopper	1600	400

IGBT Modules
Type Designation	Topology	V_CES in [V]	IC_nom in [A]
SEMiX106GD12T4p	Sixpack	1200	100
SEMiX156GD12T4p	Sixpack	1200	150
SEMiX206GD12T4p	Sixpack	1200	200
SEMiX106GD12M7p	Sixpack	1200	100
SEMiX156GD12M7p	Sixpack	1200	150
SEMiX206GD12M7p	Sixpack	1200	200
SEMiX256GD12M7p	Sixpack	1200	250
SEMiX076DGDL12M7p	CIB	1200	75
SEMiX106DGDL12M7p	CIB	1200	100
SEMiX156DGDL12M7p	CIB	1200	150
SEMiX206DGDL12M7p	CIB	1200	200