Direct Pressed Die Technology

High Performance in a Compact Design

As an evolution of Double Sided Sintering (DSS) Technology, in 2016 Semikron Danfoss presented Direct Pressed Die (DPD) Technology. In addition to sintering the chip to the DBC substrate and the flex layer to the chip, DPD Technology uses a pressure element that applies a force directly to the top of the die. This generates an optimized thermal connection to the heatsink where it is actually needed: right underneath the chip.

There is no fixed connection between DBC substrate and heatsink, which provides great flexibility of the cooling selection. A DPD-based power module can be mounted on convection or forced-air cooled heatsinks as well as water coolers. The minimized layer of thermal paste creates superb thermal conductivity, leading to excellent power density.

DPD Technology can also be integrated into standard baseplate or baseplate-less packages as well as high performance power modules. Thanks to the flexible and non-rigid connection, mechanical stress is minimized and thermal and power cycling capability reaches new benchmarks. Electrically, DPD Technology features a low stray inductance that allows for the integration of the latest wide bandgap chip technologies for extremely fast switching.

DPD Technology enables a higher power density with a longer service life compared to traditional solder-based assembly and connection technologies. Thus, it provides new solutions to the ever-increasing demands on power electronics in applications like traction inverters for e-mobility.