SEMiX®
IGBT and rectifier module family for solder-free mounting
SEMiX® Benefits
The SEMiX family includes uniform IGBT and rectifier housings. Virtually all have the same height (17mm) and the power terminals can be connected by one principle DC-link design. This saves development time and makes a simple, low inductance DC-link profile possible. Spring or press-fit contacts allow for a gate driver mounted directly on top of the module, eliminating the risk of noise on wires or loose connectors. Highly compact, state-of-the-art inverter designs are possible thanks to the flat package and separate AC and DC terminals. Avoid solder joints, use highly reliable spring and press-fit contacts for auxiliary terminals, which offers increased product reliability and lifetime.
The solder-free contacts make for quick and easy assembly. Optimize inverter production with a uniform assembly direction (everything top down). This simplifies logistics and reduces manufacturing costs.
SEMiX® Product Family
SEMiX® Spring
The SEMiX Spring package covers SEMiX 1 to SEMiX 33 in the proven 17mm module with SPRiNG contacts for auxiliary connections. SEMiX Spring modules are available in half-bridge, sixpack or chopper topology and allow a flat and compact inverter design.
SEMiX® 3 Press-Fit
The SEMiX 3p package combines the proven SEMiX with the fast and easy assembly using Press-Fit technology. SEMiX 3p is also available with integrated shunt resistors for AC current measurement.
SEMiX® 5
SEMiX 5p is a compact, baseplate power module with optimized AC and DC screw connections. Press-Fit technology allows a solder-free gate driver mounting. The SEMiX 5p is also available for NPC and T-NPC 3-level applications.
SEMiX® 6 Press-Fit
The SEMiX 6p features state-of-the-art Press-Fit pin technology for both power and auxiliary terminals. With solder-free mounting technology, the 17-mm-high SEMiX 6 maximizes production efficiency. With the SEMiX 6p, connect all terminals in a single production step.
SEMiX® Short Facts
- Low stray inductance case
- Reliable spring and press-fit connections
- Flat and compact inverter design
SEMiX® Key Features
- Half-bridge, chopper, sixpack and 3-level topologies
- Isolated copper baseplate using DBC technology
- Also available with integrated shunt resistor (SEMiX 3p)
- Multiple IGBT sources
SEMiX® Applications
SEMiX is a flexible and application-oriented module. Based on a scalable platform concept, modern chip technology is integrated into IGBT and rectifier modules which are used in a wide variety of applications, such as motor drives, uninterruptible power supplies, photovoltaic systems, wind energy and automotive applications.
SEMiX® Product Range
SEMiX IGBT modules are available in 600/650V, 1200V and 1700V. Half-bridge, sixpack and chopper topologies are available with a current range from 75A to 700A. Besides IGBT3 and IGBT4 chips, the 1200V range also includes a series with V-IGBT devices and the latest M7 technology. Controlled, half-controlled and uncontrolled rectifier modules with identical footprint are also available. For the latest housing versions, we also offer optional integrated shunt resistors and 3-level topologies (NPC, TNPC or Buck/Boost chopper topologies from 150A to 400A).
| SEMiX Portfolio | |
|---|---|
| SEMiX 3 Spring | up to 350kW |
| SEMiX 3 Press-Fit | up to 400kW |
| SEMiX 5 | up to 150kW |
| SEMiX 6 Press-Fit | up to 75kW |
SEMiX® IGBT Modules
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SEMiX® Hybrid SiC Modules
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SEMiX® Bridge Rectifier Modules
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SEMiX® Thyristor/Diode Modules
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