Solar and Energy Storage Systems
Power Electronics for Solar/ESS
Customer service
Product service
Solar Energy
This portfolio includes a wide range of products for efficient solar inverters in all power ranges: residential, industrial and utility scale. The products are scaleable, from individual modules, including dedicated drivers, to high power SKiiP 4 IPMs and ready-to-use power electronic stacks. We also offer a large portfolio of 3-level power modules, IPMs and power electronic stacks, which can reduce system costs significantly as well as optimize annual energy production, especially for increased DC voltages up to 1500VDC.
Energy Storage
With decentralized renewable energy sources in our power grid, the demand for energy storage systems to stabilize fluctuations is quickly growing. This portfolio includes a wide range of products for energy storage systems. From small and medium power modules for residential/industrial systems to high power components for utility scale systems, these products deliver maximum reliability. A variety of semiconductor packaging technologies are available to meet ESS industry lifetime requirements. From individual modules, including dedicated drivers, to high power SKiiP 4 IPMs and ready-to-use power electronic stacks – we have the solution.
- LOW/MEDIUM POWER8kW - 75kWResidential, Commercial/Industrial, Solar plus storage
- Compact designs and high power density
- High efficiency
- High reliability to reduce downtime
- MEDIUM/HIGH POWER50kW - 5MWCommercial/Industrial, Utility scale, Solar plus storage
- 1500VDC capability
- High efficiency
- High reliability to reduce downtime
Product Highlights
Comprehensive 3-Level and Booster Module Family
The SEMITOP E1/E2 packages provide supply chain security with a standard industrial design. Press-fit pins offer reduced manufacturing time and a low inductance design. Ideal for fast switching chips, such as SiC, the SEMITOP has a wide portfolio of topologies, ready for your string inverter design.
Key Features
- Low stray inductance case
- Solder-free, press-fit assembly
- Optimized thermal performance
- Flexible architecture
- Available with silicon, full SiC, or hybrid SiC
Increased Performance in 3-Level Topologies
In order to achieve economy of scale, manufacturers typically use the same hardware for solar and energy storage converters. While the three-level NPC topology works well for solar, this can often mean de-rating for energy storage while in charging mode. Thanks to the chip shrinkage from Generation 4 to Generation 7 IGBTS, there is more space for diodes. Therefore, the SEMITRANS 10 MLI offers an increased clamping diode current rating. This enables energy storage converters to work at full power while charging and discharging batteries.
Key Features
- Reduced magnetics cost thanks to 3-level topology
- Up to 1.5MW with liquid cooling
- Based on latest Generation 7 IGBTs
- Reduced cable diameters or cable losses with up to 1500VDC operation
- Reduced cooling requirements thanks to low losses
The Latest Generation 7 IGBTs for Highest Supply Chain Safety
Whenever power quality and efficiency are driving factors in power electronics applications, 3-level topologies are the key. This is especially true for renewable energy applications where the combination with the latest Generation 7 IGBTs sets new benchmarks.
For ANPC topologies, our new SEMITRANS 20 power module combines low stray inductance, high power density and Generation 7 IGBTs to set a new benchmark. This package design, based on standard half-bridge topology, allows a simple ANPC layout with low inductance DC-link connections.
Key Features
- Reduced magnetics cost thanks to 3-level topology
- Up to 2MW without paralleling
- Reduced switching losses with 1200V IGBT
- Latest Generation 7 IGBTs
- Reduced cable diameters or cable losses
- Reduced cooling requirements
Comprehensive Sixpack and 3-Level Module Family
With its comprehensive portfolio and its optimized design, the SEMiX 5 is ideal for high-performance inverter architectures. The press-fit contacts ensure fast and solder-free driver board assembly, increased reliability and reduced assembly cost. Adapter boards for easy gate drive integration are also available. The internal chip layout is optimized for enhanced thermal performance, reducing operating temperatures, thus boosting reliability. The housing features rugged moulded power terminals for superior mechanical stability.
Key Features
- Low stray inductance package
- Solder-free assembly
- Optimized thermal performance
- Flexible architecture
- Press-fit design
- 17mm module height
Exceeding the Standard
- Optimized module design for ultimate thermal footprint
- Effective heat spreading for improved thermal performance
- Longer lifetime for tighter reliability requirements
- Suitable for very fast switching applications thanks to very low inductance layouts
Intelligent Power Modules - IPMs
For Maximum Reliability for Solar and Energy Storage Converters
The SKiiP IPM product line sets a benchmark for high performance and robust inverter designs. Both SKiiP 3 and SKiiP 4 feature high power densities combined with flexible cooling options such as air and water cooling, also with customized heat sinks. Reliable driver technology, integrated current sensors and comprehensive protection functions complete the IPM design.
SKiiP 3 has propagated widely through the industrial drive segment. With its sixpack or half-bridge topologies, it covers a current range from 500A up to 2400A. The SKiiP 4, available in a half-bridge topology, has been optimized for highest power cycling requirements and covers the higher power range up to 3600A. To ensure highest reliability and service life, the power circuitry is 100% solder-free. Sinter
technology as die attach replaces the solder layer, which usually causes the limitation in lifetime. Hence, sintering improves power and thermal cycling capability.
The integrated gate driver in the SKiiP 4 has set new standards in terms of reliability and enhanced functionality through its CAN interface. The digital driver guarantees safe isolation between the primary and secondary side for both switching signals and parameter measurement. The CAN interface allows setting the SKiiP 4 configuration parameters and reading application parameters.
High Perfomance Cooling (HPC) technology has been introduced providing approximately 25% more output capability compared to standard water cooling. A double side mounting HPC water cooler is also available and enables an even higher power density.
Key Features
- 1200V and 1700V
- Half-bridge and sixpack
- 500A to 3600A
- Flexible cooling options: air, water or customized cooling options, high performance cooling, single and double side mounting water coolers
- Paralleled operation for even higher output power possible
- Special version for 1500VDC available
Power Electronic Stack Platforms
Fully Qualified Inverter Assemblies Tailored to Your Specific Needs
Standard Stacks
Our Power Electronic Stacks enable our customers to succeed in dynamic markets and meet any global challenge. We deliver Rectifier-, IGBT- and SiC-based stacks for AC voltages from 380V to 1000V. Our standard stacks cover an output current range of 70A to 4000A and building blocks based on three level topologies that are ready to use in 1500VDC environment.
- Water Cooled IGBT Stacks
SEMISTACK RE
SEMIKUBE MLI - Air Cooled IGBT Stacks
SEMIKUBE 1500V
SEMIKUBE SlimLine
SEMIKUBE MLI (1500V capable)
Customized Stacks
In addition to standard stacks, Semikron Danfoss has vast experience in developing customer-specific solutions. Engineers are available in our stack centers around the globe to offer specific solutions by adapting existing platforms or designing customized converters.
Four Key Factors to Your Success
- Shortest time to market
- Cost savings in R&D, production and qualification
- Global Semikron Danfoss stack production footprint
- Highly experienced engineering team
Thermal Interface Materials
Stay Cool - Heat Dissipation is Our Job
Semikron Danfoss was the first power module manufacturer on the market to offer power modules with pre-applied thermal interface material (TIM). We now have over two decades of experience and more than 25 million pre-printed modules in the field.
We design print patterns for each module type for the best TIM distribution and thickness when the module is mounted to a heatsink. These patterns are printed on the modules in a clean environment on an automated silkscreen and stencil printing line. Statistical process control (SPC) is used to guarantee consistency. Special packaging is implemented to ensure that the TIM arrives at your production line in pristine condition.
In order to achieve the best thermal performance in all applications, Semikron Danfoss power modules can be supplied with our High Performance Thermal Paste (HPTP).
Alternatively, for ease-of-handling during assembly, most power modules are also available with pre-applied phase change material (PCM). Phase change materials have a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface. With HP-PCM, the new Semikron Danfoss-exclusive High Performance Phase Change Material, we combine the benefits of a phase change material with the performance of the best available paste.
Key Features
- Best possible thermal performance
- Simplified logistics and reduced production costs
- Improved assembly robustness
- Increased lifetime and reliability
Portfolio
- HPTP: High Performance Thermal Paste
- HP-PCM: High Performance Phase Change Material
